VEM Vacuum Engineering and Materials

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Titanium

  • Chemical Symbol: Ti
  • Atomic Number: 22
  • Atomic Weight: 47.867
  • Density: 4.506 g·cm−3
  • Melting Point: 1941 K
  • Boiling Point: 3560 K
  • Heat of Fusion: 14.15 kJ·mol−1
  • Heat of Vaporization: 425 kJ·mol−1
  • Molecular Heat Capacity: 25.060 J·mol−1·K−1
  • Electrical Resistivity: (20 °C) 420 nΩ·m
  • Thermal Conductivity: 21.9 W·m−1·K−1
  • Thermal Expansion: (25 °C) 8.6 µm·m−1·K−1

Foundry

Foundry is a booming business that manufactures parts for hundreds of industries. Foundries manufacture semiconductor devices for a variety of end markets. Given the breadth of devices they manufacture, foundries require extensive materials. VEM supplies foundries with sputtering targets and evaporation materials ranging from Aluminum to Zirconium and just about everything in between.

Data Storage

The demand for data storage seems endless. Big data is driving the requirement for big data storage devices. New materials continue to enable innovative solutions to today's data storage challenges. VEM is working with the major data storage suppliers to provide these solutions.

Emerging Display Technologies

With the growth of smartphones and tablets, new display technologies is a fast growing business. New demands on display performance require new materials. VEM has the solutions.

Visual and display technology is one of the fastest growing fields in the industry. Every year displays become bigger, brighter and better. Keeping up with this new technology requires only the most cutting edge components. VEM provides high quality materials at competitive prices to producers. We will work with you to assure that your product has a high performance.

Our components include:

Advanced Packaging

IC packaging is the final step in the semiconductor fabrication process before testing and shipping devices to customers. A large number of different types of packages exist and new ones continue to be developed. In addition, integrated circuit dies are often developed for direct connection to a substrate. In flip chip systems the IC is connected by solder bumps to a substrate. All of these packaging technologies require new material. VEM is working with a breadth of packaging suppliers to develop new solutions to the challenges they're facing.

Power Devices

Power devices are semiconductor devices used as switches or rectifiers in power electronics. They include power diodes, MOSFETs and IGBTs. VEM has been working with suppliers of all of these devices to provide innovative solutions to their materials needs.

Evaporation Materials: VEM provides evaporation materials ranging from pure elements to compounds and alloys. We provide our metals in many shapes and sizes from small granules and wire to large pellets to suit any needs. VEM will collaborate with you to provide you with materials to your specifications.

Photovoltaics

Photovoltaics are a method of generating electrical power by converting light into electricity. There are a variety of solar cell technologies competing for highest efficiency and lowest cost. Thin film technology is crucial to a solar cell, and VEM has the answers with our high purity Sputtering Targets and Evaporation Materials. The most common technologies are crystalline silicon (c-Si), Cadmium Telluride (CdTe), and Copper Indium Gallium Selenide (CIGS). VEM provides materials for all of these technologies.

MEMS

Micro-Electro-Mechanical Systems, or MEMS, are micro-structures created using semiconductor fabrication processes. MEMS devices are widely used in consumer, communication, and computer applications. They include gyroscopes, accelerometers, inertial measurement units, pressure sensors, inertial sensors, RF devices, microphones, micro-bolometers, and inkjet heads. VEM is working with many of the leading MEMS suppliers and foundries for both process and packaging solutions.

LED’s

Light-Emitting Diodes, or LED's are devices that emit infrared or visible light when charged with an electric current. LED's are rapidly being adopted as an efficient and low energy solution in a broad range of applications from indicator lamps to general lighting. LED's are fabricated on compound semiconductor substrates such as GaAs and GaN. VEM is working with many of the largest suppliers of LED devices. We're helping them develop new materials and new solutions to their R&D and production challenges.

Our components include:

RF Wireless Communications

The rapid growth of smartphones has driven a demand for high speed communications devices. The explosive growth of this industry requires significant high quality materials to keep up with the constant new innovations. These materials must be of high purity and low resistivity to provide maximum performance. We supply ultra high purity gold Evaporation Materials in any shape or size you may need at fair prices. VEM is working with all of the major RF Wireless device manufacturers to find solutions to their next generation devices.