IC packaging is the final step in the semiconductor fabrication process before testing and shipping devices to customers. A large number of different types of packages exist and new ones continue to be developed. In addition, integrated circuit dies are often developed for direct connection to a substrate. In flip chip systems the IC is connected by solder bumps to a substrate. All of these packaging technologies require new material. VEM is working with a breadth of packaging suppliers to develop new solutions to the challenges they're facing.

Power devices are semiconductor devices used as switches or rectifiers in power electronics. They include power diodes, MOSFETs and IGBTs. VEM has been working with suppliers of all of these devices to provide innovative solutions to their materials needs.

Evaporation Materials: VEM provides evaporation materials ranging from pure elements to compounds and alloys. We provide our metals in many shapes and sizes from small granules and wire to large pellets to suit any needs. VEM will collaborate with you to provide you with materials to your specifications.